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IC Packaging / Testing / Reliability Services

  • Consulting on packaging technologies:
     1. Die mount type (wire bond/flip chip)
     2. Package type (leadframe QFN/QFP, high-pin-count BGA/LGA, others)
     3. Body material (plastic, ceramic, others)
  • Technical support for substrate and package design
  • Joint simulation and control of signal integrity and heat sink, IBIS modelling
  • Selection of packaging and assembly service provider for the project
  • Integration of multi-chip modules (MCM), systems in a package (SiP) and chiplets into 2.5D/3D assemblies
 
  • Selection, development and delivery of test sockets
  • Technnical consulting on IC testing (OWT/CP/FT)
  • Selection of testing services provider
  • Development of hardware and software for testing (PCB & probe cards)
  • Automated testing of wafers and chips in different packages
 
  • Qualification tests and failure analysis
  • Electronic validity maps issue
  • Yield analysis and optimization
  • IC reliability test

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