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IC Packaging & Testing / Reliability Services
IC Packaging & Testing / Reliability Services
- Consulting on packaging technologies:
1. Die mount type (wire bond/flip chip)
2. Package type (leadframe QFN/QFP, high-pin-count BGA/LGA, others)
3. Body material (plastic, ceramic, others) - Technical support for substrate and package design
- Joint simulation and control of signal integrity and heat sink, IBIS modelling
- Selection of packaging and assembly service provider for the project
- Integration of multi-chip modules (MCM), systems in a package (SiP) and chiplets into 2.5D/3D assemblies
- Selection, development and delivery of test sockets
- Technnical consulting on IC testing (OWT/CP/FT)
- Selection of testing services provider
- Development of hardware and software for testing (PCB & probe cards)
- Automated testing of wafers and chips in different packages
- Qualification tests and failure analysis
- Electronic validity maps issue
- Yield analysis and optimization
- IC reliability test
