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IC Services

Foundry Services

  • Selection of technology nodes and a foundry for the production of wafers or chip dice
  • IC manufacturing based on the full mask set (NTO), engineering lots, split conditions
  • Revision tapeouts (RTO)
  • Prototyping and small-scale production within MPW runs
  • Mass production of wafers, dice and chips in package
  • Integration of multi-chip modules (MCM), systems in a package (SiP) and chiplets into 2.5D/3D assemblies
  • Wafer storage services

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